Thermal Stability: Withstanding the Harsh Reflow Soldering Environment

In the 260℃ reflow soldering process, the coefficient of thermal expansion of 7075 aluminum alloy is as low as 23.5×10⁻⁶/℃. Combined with the honeycomb hollow design, the heat dissipation efficiency is increased by 70%. The surface hard anodized film (HV≥800) can block high-temperature oxidation, ensuring that the fixture can work continuously for 2000 hours at 500℃ without warpage. Actual measurements on the BYD battery module production line show that the hole positioning accuracy remains at ±5μm throughout the process, and the yield rate is increased to 99.6%.