Integrated Liquid Cooling Radiator: 6063 Aluminum Alloy Microchannel Technology

The 6063 liquid cooling plate utilizes etched microchannels (wall thickness ≤ 0.8 mm) with embedded copper tubes to achieve a “copper-aluminum composite” structure:

The copper heat conduction layer (400 W/(m·K)) rapidly dissipates core heat.

The aluminum casing reduces weight by 60%, and the hydraulic expansion tube interface achieves a fit of >99%.

Thermal resistance is reduced by 30%, and the heat dissipation power of the GPU server is increased to 500 W.
Lifespan Guarantee: Free from melting weld porosity defects, with a designed lifespan of 20 years (Patent CN106409792A).