High Heat Dissipation Chassis/Cabinet Design: The Thermal Management Advantages of 6061

Product name:	High Heat Dissipation Chassis/Cabinet Design: The Thermal Management Advantages of 6061
Keywords:	6061
Industry:	Industrial electronics and electrical engineering - Battery industry
Process:	Others - Others
Material:	Aluminum

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Product details

6061 chassis utilize a skiving process to create high-density fins (50% increase in fin height ratio), increasing the heat dissipation area by 40% compared to stamped steel plates. Combined with liquid cooling plate microchannels (0.8mm wall thickness), the heat dissipation power density reaches 300W/cm², solving the overheating and downtime issues of GPU server clusters, and reducing the internal temperature by 15℃ compared to SPCC chassis.

Core advantages: active cooling, lightweight, temperature control.

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