Active Cooling Design: The Thermal Management Advantages of 6061

The 6061 chassis utilizes a skiving process to create high-density fins (with a 50% increase in fin height ratio), increasing the heat dissipation area by 40% compared to stamped steel plates. Paired with microchannels in the liquid cooling plate (0.8mm wall thickness), it achieves a heat dissipation power density of 300W/cm², resolving overheating and downtime issues in GPU server clusters. The surface anodized film reduces heat radiation absorption, resulting in an internal temperature 15°C lower than SPCC chassis.