6063 Aluminum Alloy Liquid Cooling Integration: High-Power Heat Dissipation Solution

The 6063 liquid cooling plate utilizes etched microchannels (wall thickness ≤ 0.8 mm) with embedded copper tubes to achieve a "copper-aluminum composite" structure:

The copper heat conduction layer (400 W/(m·K)) rapidly conducts heat away from the core components.

The aluminum shell reduces weight by 60%, and hydraulic expansion technology ensures an interface fit of >99%.

Thermal resistance is reduced by 30%, and the heat dissipation power of the GPU server is increased to 500 W.³
Patent CN106409792A shows that this design avoids melting welding porosity defects and has a lifespan of 20 years.