3D Printed Heatsink Breakthrough: Dual 200 High Conductivity Aluminum Alloy
| Product name: | 3D Printed Heatsink Breakthrough: Dual 200 High Conductivity Aluminum Alloy |
| Keywords: | Aluminum Alloy |
| Industry: | Industrial electronics and electrical engineering - Battery industry |
| Process: | Others - Others |
| Material: | Alloy steel |
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Product details
The Baohang team has developed HC200 high-conductivity aluminum:
Thermal conductivity > 200 W/(m·K) + Tensile strength > 200 MPa;
Compared to AlSi10Mg (140 W/(m·K)), thermal performance is improved by 43%;
Adapts to complex microchannel heatsink structures, supports lightweight integrated design.
Limitation: Powder supply is not currently available, only printing services are offered (cost is 30% higher than traditional methods).
Thermal conductivity > 200 W/(m·K) + Tensile strength > 200 MPa;
Compared to AlSi10Mg (140 W/(m·K)), thermal performance is improved by 43%;
Adapts to complex microchannel heatsink structures, supports lightweight integrated design.
Limitation: Powder supply is not currently available, only printing services are offered (cost is 30% higher than traditional methods).
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